NXP Announces New Series of 20 V and 30 V MOSFETs in Ultra-Small DFN Packages DFN0603

July 6, 2022: HYPERLINK  the high throughput production specialist in basic semiconductor devices, today announced the launch of a new family of 20 V and 30 V MOSFETs in the ultra-small DFN0603 package. Nexperia has already offered ESD protection devices in this package and now takes it a step further by successfully applying it to its MOSFET portfolio. Now it has gone a step further and has successfully applied this package technology to its MOSFET portfolio, making Nexperia a competitive leader in the industry. This family of small MOSFETs includes. 

The new generation of wearable and audible devices are incorporating new artificial intelligence (AI) and machine learning (ML) technologies, which pose several challenges for product design. First, as functionality increases, the board space available becomes very valuable, and also, as power consumption increases, heat dissipation becomes an issue that cannot be ignored. 

Nexperia, an industry leader in discrete device manufacturing, with decades of experience, has designed this ultra-small innovative MOSFET series to successfully overcome both of these issues. The ultra-thin DFN0603 package, measuring only 0.63 x 0.33 x 0.25 mm, uses 13% less space than the MOSFET in the second smallest package (DFN0604). Amazingly, this size reduction has no impact on device performance; in fact, the RDS(on) of these MOSFETs is reduced by 74%, which helps improve efficiency and thus enables wearable designers to achieve greater power density. 

This new family of small MOSFETs includes. 

PMX100UN20V, N-channel TrenchMOSFET

PMX100UNE20V, N-channel TrenchMOSFET with 2kV ESD protection (HBM)

PMX300UNE30V, N-channel TrenchMOSFET

PMX400UP20V, P-channel TrenchMOSFET 

Nexperia plans to add two more MOSFETs to the family in the second half of 2022