Samsung recently denied reports of a delay in mass production of 3nm chips

June 22, according to China's Taiwan Economic Daily, Samsung recently denied reports of a delay in mass production of 3nm chips. A Samsung spokesperson said by phone that it is still on schedule to start mass production of 3nm chips in the second quarter.

Earlier, a foreign media sources said that Samsung 3nm chip mass production will be delayed again because the yield rate is far below the target.

It is reported that Samsung's next-generation 3nm chips will be based on Gate-All-Around (GAA) technology, which Samsung said can reduce It is reported that Samsung's next-generation 3nm chips the area by 45% compared to existing FinFETs, while providing a 30% performance boost and 50% power reduction.

In addition, Samsung said its 2nm process node is in the early stages of development, with mass production planned for 2025.

In June, Samsung Vice Chairman Lee Jae-yong kicked off a 7-day European shuttle tour, and official sources show that Lee met with ASML executives, including CEO Peter Wennink and CTO Martin van den Brink, at ASML's headquarters in Veldhoven, the Netherlands, on June 14 (local time).

According to Korean media BusinessKorea, Samsung Electronics Vice Chairman Lee Jae-yong received additional extreme ultraviolet (EUV) lithography equipment from ASML, which is crucial for the production of next-generation semiconductors. However, Samsung Electronics has not disclosed details of the additional EUV lithography equipment that ASML will provide for the time being.

It is reported that the implementation of the 3/2nm process is highly dependent on ASML's new generation of EUV lithography. Industry sources indicate that ASML shipped 48 units of EUV equipment in 2021, Samsung and TSMC purchased 15 units and 20 units respectively.

In recent years, Samsung's ambition to catch up with TSMC has become more and more obvious, especially in the advanced process that reflects the technological heritage of both sides, which has led to Samsung's recent dynamics, including replacing the head of the semiconductor R & D center, to improve the yield of advanced processes.

"The first is technology, the second is technology, the third is also technology," Lee Jae-yong said earlier this month after returning from a business trip to Europe.